Saturday, June 11, 2005
Here's an idea I had for a slightly different way of attaching components to a reprap that may improve bonding and electrical properties.
Another advantage of this approach is that you can potentially have multiple layers of components, making use of three dimensions rather than just two. This could be quite beneficial given the small scale integration density of the RP approach. Unfortunately this would require human intervention for each layer. Of course once the basic system is working, no doubt others will build add-ons to automate more of the process, so a little human intervention isn't much of a disadvantage in the early days.